Title:
BONDING MATERIAL AND BONDING BODY COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2018165387
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding material that allows an electronic component to be bonded to a substrate with a silver bonding layer that resists large cracking even when subjected to repeated thermal cycles, and a bonding body with the electronic component bonded to the substrate with the bonding material.SOLUTION: The present invention provides a bonding body in which a semiconductor chip such as an SiC chip (with a silver-plated bonding face) as an electronic component through a silver bonding layer including a silver sintering body is bonded to a copper substrate, wherein the silver bonding layer has a shear strength of 60 MPa or more, and a (111) face of the silver bonding layer has a crystallite diameter of 78 nm or less.SELECTED DRAWING: Figure 1
Inventors:
HORI TATSURO
ENDO KEIICHI
FUJIMOTO HIDEYUKI
KURITA TORU
ENDO KEIICHI
FUJIMOTO HIDEYUKI
KURITA TORU
Application Number:
JP2017063351A
Publication Date:
October 25, 2018
Filing Date:
March 28, 2017
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F7/04; B22F1/054; B22F1/0545; B22F1/102; B22F1/103; B22F1/17; B22F3/14; B82Y30/00; H05K1/09
Domestic Patent References:
| JP2011094223A | 2011-05-12 | |||
| JP2015018986A | 2015-01-29 |
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Other References:
井田 隆, シェラーの式 SCHERRER'S EQUATION の使われ方にみられる混乱について, JPN7020003717, 21 November 2007 (2007-11-21), ISSN: 0004489143
（株）あさひ総研, "グラインドゲージ（粒度ゲージ）, JPN7020003718, 13 November 2020 (2020-11-13), ISSN: 0004489144
（株）あさひ総研, "グラインドゲージ（粒度ゲージ）, JPN7020003718, 13 November 2020 (2020-11-13), ISSN: 0004489144
Attorney, Agent or Firm:
Koichi Okawa