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Title:
BONDING OF METAL FRAME PANELS BY HIGH FREQUENCY DIELECTRIC HEATING
Document Type and Number:
Japanese Patent JPS5698127
Kind Code:
A
Abstract:

PURPOSE: To exactly bond frame materials with uniform electric field intensity for the adhesive portion by inserting a V-shaped elastic electrode material projecting from a power-feeding tool into a space between frame materials formed into the corners for a metal frame assembly and then supplying a power to the electrode material.

CONSTITUTION: Metal frame materials 4 of a U-shaped section are assembled so as to form a space 5 with the same width in the bonded portion of the frame materials 4 in four corner portions in order to form a metal frame assembly. Then, a thermosetting resin adhesive 2 is coated on the upper and lower both surfaces of the frame assembly 1, face materials 3 are laid on the upper and lower both surfaces to form metal frame panel a V-shaped elastic electrode material 7 projecting from a movable power-feeding tool 6 is inserted into the space 5 between the corners of the frame assembly 1, the metal frame panel is put between the upper and lower parallel electrodes 9, and then a high frequency current is supplied from a high frequency power source 10 to harden the adhesive 2.


Inventors:
WADA TAMEYOSHI
Application Number:
JP109480A
Publication Date:
August 07, 1981
Filing Date:
January 09, 1980
Export Citation:
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Assignee:
NAT JUTAKU KENZAI
International Classes:
B29C53/00; B29C65/00; B29C65/04; B29C65/48; (IPC1-7): B29C27/04