Title:
BONDING METHOD FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH04246842
Kind Code:
A
Abstract:
PURPOSE: To offer a bonding method which surely causes friction by ultrasonic vibration and makes excellent wire bonding possible, by using a method wherein in the case a circuit board is made an electrical connection using an ultrasonic wire bonding method, a material to be bonded, such as the circuit board or the like, is bonded on a case body in order to solve a trouble to say that the material to be bonded is made to make the ultrasonic vibration and a bonding failure is generated.
CONSTITUTION: The lower parts of at least parts, on which a wire bonding is performed, of a circuit board or an electric component 6 are bonded on a case body 7 using a liquid bonding agent 9.
Inventors:
KAWAZU AKIYOSHI
TAKENAKA TOSHIAKI
NISHII TOSHIHIRO
NAKAMURA SHINJI
TAKENAKA TOSHIAKI
NISHII TOSHIHIRO
NAKAMURA SHINJI
Application Number:
JP1187191A
Publication Date:
September 02, 1992
Filing Date:
February 01, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/52; H01L21/58; H01L21/60; H01L21/607; (IPC1-7): H01L21/52; H01L21/58; H01L21/60; H01L21/607
Attorney, Agent or Firm:
Akira Kobiji (2 outside)