Title:
BONDING METHOD OF CLAD METAL WITH METAL COMPONENT, AND METHOD FOR MANUFACTURING THERMAL TRIPPING DEVICE WITH USE OF THE BONDING METHOD, AND CIRCUIT BREAKER
Document Type and Number:
Japanese Patent JP2015116577
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding method of a clad metal with a metal component by which scattering of a molten material, that occurs during bonding, can be prevented while obtaining a sufficient bond strength.SOLUTION: A bonding method of a clad metal with a metal component includes: a process in which a clad metal having a hole in a main body thereof is prepared; a process in which a metal component, that has a protrusion having a diameter larger than that of the hole in the clad metal and has a hole having a diameter larger than that of the hole opened in the clad metal at a tip of the projection, is prepared; and a process in which the hole provided in the protrusion of the metal component is brought into contact with and is welded to the hole provided in the clad metal.
Inventors:
DEGUCHI TOMOYA
ISHIHARA TOYOHEI
AKASAKA KENICHI
ISHIHARA TOYOHEI
AKASAKA KENICHI
Application Number:
JP2013259818A
Publication Date:
June 25, 2015
Filing Date:
December 17, 2013
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K11/14; B23K11/00; B23K11/20; H01H73/22
Domestic Patent References:
| JPS63153454U | 1988-10-07 | |||
| JP2007301625A | 2007-11-22 | |||
| JPS55136584A | 1980-10-24 | |||
| JP2007301577A | 2007-11-22 | |||
| JPS6366582U | 1988-05-02 | |||
| JPS60181278U | 1985-12-02 | |||
| JPS5227919U | 1977-02-26 |
Foreign References:
| US20080019767A1 | 2008-01-24 |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa