Title:
BONDING METHOD, BONDING DEVICE, AND BONDING MEMBER
Document Type and Number:
Japanese Patent JP2012125805
Kind Code:
A
Abstract:
To provide a bonding method, a bonding device, and bonding members capable of uniformly bonding the entirety of bonding surfaces and obtaining stable bonding strength.
The bonding surfaces 10a, 20a of a pair of bonding members 10, 20 to be bonded with each other are made to face each other, and an electric current is made to flow from one of the pair of bonding members to the other to perform resistance heating while the pair of bonding members are slid relative to each other. Further, bonding is performed while supporting an inner wall surface 13 of a space portion 11 provided to one bonding member by a reinforcing member 100.
Inventors:
FUKAMI TORU
USHIJIMA KENJI
MIZUNO HIDEAKI
USHIJIMA KENJI
MIZUNO HIDEAKI
Application Number:
JP2010279807A
Publication Date:
July 05, 2012
Filing Date:
December 15, 2010
Export Citation:
Assignee:
NISSAN MOTOR
International Classes:
B23K20/00; B23K11/11; B23K11/12; B23K28/02; B23K20/10
Domestic Patent References:
| JPS6199590A | 1986-05-17 | |||
| JP2007175740A | 2007-07-12 | |||
| JP2004174546A | 2004-06-24 | |||
| JPS6487803A | 1989-03-31 | |||
| JPS6199590A | 1986-05-17 |
Foreign References:
| US20060169388A1 | 2006-08-03 | |||
| US20060169388A1 | 2006-08-03 |
Attorney, Agent or Firm:
Hatta International Patent Corporation
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