Title:
BONDING METHOD AND LAMINATE
Document Type and Number:
Japanese Patent JP2003147308
Kind Code:
A
Abstract:
To obtain a bonding method and its laminate improving solvent resistance which was difficult to achieve by a conventional bonding method, in a manufacturing method of the laminate comprising bonding a polymeric foam and textiles.
The bonding method and its laminate presenting good dry adhesion and water resistant bond strength, and besides practically sufficient organic solvent resistance are obtained by bonding an adherend using an aqueous series adhesive comprising a polychloroprene series latex composition as a principal component, the composition comprising a dithiocarbamate and/or a xanthogenate.
Inventors:
WATANABE KOSUKE
MOCHIZUKI KENJI
MOCHIZUKI KENJI
Application Number:
JP2001349957A
Publication Date:
May 21, 2003
Filing Date:
November 15, 2001
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
B32B5/24; C09J5/00; C09J111/02; C09J175/04; (IPC1-7): C09J111/02; B32B5/24; C09J5/00; C09J175/04
Previous Patent: ADHESIVE AND MOLDING USING THE SAME
Next Patent: ADHESIVE COMPOSITION AND MANUFACTURING METHOD OF WOODEN PLATE USING THE SAME
Next Patent: ADHESIVE COMPOSITION AND MANUFACTURING METHOD OF WOODEN PLATE USING THE SAME