BONDING METHOD, AND MEMBER TO BE BONDED

Japanese Patent JP2012125804

A

To provide a bonding method and members to be bonded enabling stable bonding strength to be obtained even when cut surfaces for forming hollow passages and extending along the axes of the hollow passages are set as bonding surfaces which are not on the same plane.

This bonding method is for bonding a pair of bonding members 10, 20 that comprise a conductive material and have the bonding surfaces which are not on the same plane. The bonding method includes a bonding step in which the bonding surfaces 10a, 20a of the bonding members bonded to each other are made to face each other, an electric current is made to flow from one of the bonding members to the another to perform resistance heating while the pair of bonding members are slid relative to each other, and the bonding surfaces are bonded to each other. Further, the cut surfaces 120 for forming the hollow passages 110, 111 and extending along the axes of the hollow passages are set as the bonding surfaces which are not on the same plane.

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MIZUNO HIDEAKI
FUKAMI TORU
USHIJIMA KENJI

JP2010279806A

July 05, 2012

December 15, 2010

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NISSAN MOTOR

B23K20/00; B23K11/11; B23K11/12; B23K20/24; B23K28/02; B23K20/10

JP2005271050A	2005-10-06
JPH07116868A	1995-05-09
JP2009000700A	2009-01-08
JP2004174546A	2004-06-24
JP2007177622A	2007-07-12
JPH05337639A	1993-12-21
JP2007118059A	2007-05-17
JP2005271050A	2005-10-06
JPH07116868A	1995-05-09
JP2009000700A	2009-01-08
JP2004174546A	2004-06-24

Hatta International Patent Corporation

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