BONDING METHOD FOR PREVENTING PEELING OF BONDED SITE OF NONFLAMMABLE WOODEN MATERIAL

Title:

BONDING METHOD FOR PREVENTING PEELING OF BONDED SITE OF NONFLAMMABLE WOODEN MATERIAL

Document Type and Number:

Japanese Patent JP2007168410

Kind Code:

A

Abstract:

To provide a method by which an applied site is not peeled when applying an adhesive for bonding a plywood, a bonded wood as building materials and a wood treated by an agent.

Both are interleaved with a laminate of an adhesive constituted by mixing any of a melamine resin, phosphoric acid or phosphoric acid compound or two or more kinds of them and a fibrous porous material with high hygroscopicity, for example, Japan paper, so that the bonded site can be prevented from being peeled and adhesion strength can be held.

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Inventors:

ITO HAYAO

Application Number:

JP2005381115A

Publication Date:

July 05, 2007

Filing Date:

December 21, 2005

Export Citation:

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Assignee:

IMUNOBAKKUSU JAPAN KK
ITO HAYAO
ITO KAORI
ITO DAVI

International Classes:

B27D1/04; C09J5/00; C09J11/00; C09J161/28; C09J185/02

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