Title:
BONDING METHOD, AND PRINTER
Document Type and Number:
Japanese Patent JP2011121180
Kind Code:
A
Abstract:
To provide a bonding method wherein, when a medium is bonded with an inkjet printer, unsealing can be clearly confirmed after once the bonded part is opened.
The bonding method includes forming an image on a transparent medium (developed envelope) 301 by discharging an ink from the head part of a printer, forming an adhesive discharged surface 304 with an adhesive which is cured by irradiating with a light, irradiating the adhesive discharged surface with the light from an irradiating part of the printer, and bonding the medium (developed envelope) 301 formed with the image and a medium to be bonded across an bonding surface formed by irradiating the adhesive discharged surfaces 304, 304L1-304L8, 304R1-304R8 with the light.
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Inventors:
YAMADA TOMOHITO
Application Number:
JP2009278271A
Publication Date:
June 23, 2011
Filing Date:
December 08, 2009
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B43M5/04; B41J2/01; B41M5/00; C09J5/00
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka
Osamu Suzawa
Kazuhiko Miyasaka