Title:
BONDING METHOD FOR RUBBER MATERIAL AND BONDING STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP3505049
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the bonding force of a rubber material by oxidizing the surface of the rubber material and applying a substrate material containing an isocyanate compound and an organic chloridized compound on the surface of the oxidized rubber material.
SOLUTION: The surface 1a of a rubber material 1 is oxidized. A substrate material 2 containing an isocyanate compound and an organic chloridized compound is applied on the surface 1a of the oxidized rubber material 1. A chloroprene bonding agent 3 is applied on the surface of the substrate material 2. As the affinity with the chloroprene bonding agent is enhanced by the organic chloridized compound, the bonding force between the substrate material 2 and the chloroprene bonding agent 3 is increased. The rubber material 1, therefore, can be bonded firmly with a material to be bonded through the substrate material 2 and the chloroprene bonding agent 3.
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Inventors:
Yoshihiro Yabushita
Kenichi Harano
Kenichi Harano
Application Number:
JP27181496A
Publication Date:
March 08, 2004
Filing Date:
September 20, 1996
Export Citation:
Assignee:
ASICS Corporation
International Classes:
A43B13/32; B32B7/12; B32B25/16; C08J5/12; (IPC1-7): B32B25/16; A43B13/32; C08J5/12
Domestic Patent References:
| JP2289343A | ||||
| JP4228760A | ||||
| JP5724236A |
Attorney, Agent or Firm:
Yoshinobu Yamamura