Title:
BONDING METHOD AND STRUCTURE OF RESIN MEMBERS
Document Type and Number:
Japanese Patent JP2019072906
Kind Code:
A
Abstract:
To provide a bonding method and a bonding structure of resin members which do not require a jig for pressing and holding during curing of an adhesive when bonding the resin members with each other by the adhesive.SOLUTION: The bonding structure of an inner panel 2 and an outer panel 3 which constitute a back door of a vehicle, includes: an adhesive layer 4 for bonding the inner panel 2 and the outer panel 3; and a welded portion 5 welded by irradiation of a laser beam 11. At the inner panel 2, a projecting portion 6, having the same height dimension as a thickness dimension W1 of the adhesive layer 4, whose projecting end constitutes the welded portion 5, is formed.SELECTED DRAWING: Figure 2
Inventors:
ENOMOTO SHIGERU
Application Number:
JP2017200058A
Publication Date:
May 16, 2019
Filing Date:
October 16, 2017
Export Citation:
Assignee:
YACHIYO IND CO LTD
International Classes:
B29C65/52; B23K26/57; F16B5/08; F16B11/00
Attorney, Agent or Firm:
Isono International Patent and Trademark Office