Title:
BONDING METHOD FOR THERMOPLASTIC AND THERMOSETTING FOAMED MATERIAL
Document Type and Number:
Japanese Patent JPH01146725
Kind Code:
A
Abstract:
PURPOSE:To bond effectively and efficiently two materials without using a adhesive by forming a number of column-shaped or needle-shaped projections of a given diameter and a height on the surface of a thermoplastic molded product or sheet at intervals respectively, piling up a thermosetting foamed material on the surfaces of the projections and heating the thermoplastic on the projection side in a pressurized state. CONSTITUTION:A number of column-shaped or needle-shaped projections 3 of 0.5-3mm diameter and 1-5mm height are formed on the surface of a thermoplastic molded product or sheet 1 at intervals. The ends of the projections 3 are thrusted into a thermosetting foamed material 2 after piling up the foamed material 2 on the surfaces of the projections 3 and pressurizing. The ends of the projections 3 are melted and softened to deform into a nail head shape in the foams 2 by heating the plastic on the projection side in a pressurized state and the foams are caulked to the plastic on the projection side by the end nail head shaped sections 10 of the projections.
Inventors:
NAGAYAMA TAKASHI
Application Number:
JP30325787A
Publication Date:
June 08, 1989
Filing Date:
December 02, 1987
Export Citation:
Assignee:
KOBAYASHI KOGYOSHO KK
International Classes:
B29C65/02; B29C37/00; B29C65/00; B29C67/00; B29C69/00; B32B5/18; B32B27/08; B32B38/00; B29C65/08; B29K101/10; B29K105/04; (IPC1-7): B29C65/02; B29C69/00; B29K101/10; B29K105/04; B32B5/18; B32B27/08; B32B31/12
Attorney, Agent or Firm:
Takeda Kenichi