Title:
BONDING METHOD OF THERMOSETTING RESIN MOLDED PRODUCTS
Document Type and Number:
Japanese Patent JP2005053041
Kind Code:
A
Abstract:
To provide a method for simply and mutually bonding thermosetting resin molded products such as artificial marbles or the like by large adhesive force.
In the method for mutually bonding the thermosetting resin molded products 1 and 1, the mutual adhesive surfaces 11 and 11 of them are roughened so that surface roughness Ra is set to 2-10 μm before the thermosetting resin molded products are bonded by an adhesive. The thermosetting resin molded products are artificial marbles and a thermosetting resin is an unsaturated polyester resin. Preferably, an acrylic resin adhesive 2 or an epoxy resin adhesive 3 is used as the adhesive.
Inventors:
IBI HIDEMI
KOJIMA HIROSHI
KURODA ATSUO
KOJIMA HIROSHI
KURODA ATSUO
Application Number:
JP2003285204A
Publication Date:
March 03, 2005
Filing Date:
August 01, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J5/12; B29C65/48; C09J5/02; C09J133/00; C09J163/00; B29K101/10; (IPC1-7): B29C65/48; C08J5/12; C09J5/02; C09J133/00; C09J163/00