Title:
BONDING METHOD
Document Type and Number:
Japanese Patent JP3020093
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding method for semiconductor device having no resin exposure to the packages outside of bonding wire, even in the case of using the sealed resin package of thin type for sealing resin of semiconductor element.
SOLUTION: Between a bonding pad 2 formed on the semiconductor element on an island 1 and an inner lead 3, a bonding wire 5 coated by low melting point resin 4 is arranged so that the side of low melting point resin 4 can contact with the bonding pad 2 and the inner lead 3. Thereafter, the bonding pad 2 and the inner lead 3 are connected by heat melting of the low melting point resin 4, and the bonding process is completed, removing the melted low melting point resin 4.
Inventors:
Tadayuki Shintani
Application Number:
JP29693797A
Publication Date:
March 15, 2000
Filing Date:
October 29, 1997
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Opening Muneaki
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