Title:
BONDING METHOD
Document Type and Number:
Japanese Patent JPH09111193
Kind Code:
A
Abstract:
To obtain a high bonding strength by using a curable primer and a curable pressure-sensitive adhesive cast tape or sheet.
A primer layer containing an ethylenically unsaturated compound and a decomposition accelerator for a polymerization initiator is provided on the surface of a first adherend, and a second adherend is then bonded thereto through a cast tape consisting of an ethylenically unsaturated compound, a pressure-sensitive adhesive acrylic polymer and a polymerization initiator.
Inventors:
YANAGI MASATO
Application Number:
JP26657295A
Publication Date:
April 28, 1997
Filing Date:
October 16, 1995
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
C09J7/02; C09J4/02; C09J5/02; (IPC1-7): C09J5/02; C09J4/02; C09J7/02
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