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Title:
BONDING METHOD
Document Type and Number:
Japanese Patent JPS58185673
Kind Code:
A
Abstract:

PURPOSE: To provide adhesiveness of a sufficient bond strength without prolonged press, by mingling a hot-melt adhesive with a room temp. setting adhesive, in bonding a panel frame to a face sheet in prefabricated houses.

CONSTITUTION: In prefabricated houses, upper and lower surfaces of a panel frame 1 made of wood, etc. and the area of contact of a face sheet 2 made of plywood, iron sheet, etc. with the panel frame 1 are applied with a hot-melt adhesive and a room temp. setting adhesive, and the face plates 2 are put on the panel frame 1, wherein the application is made in a molten state of the hot- melt adhesive. A number of resulting panels 3 are allowed to cure by heaping them up. The hot-melt adhesive becomes hardened readily to stick to the panels. During the cure, the room temp. setting adhesive becomes curred gradually by the clamping effect of the hot-melt adhesive hardened in advance to obtain a strong bond strength without resort to long-term press.


Inventors:
MURAI TATSUROU
Application Number:
JP6900282A
Publication Date:
October 29, 1983
Filing Date:
April 23, 1982
Export Citation:
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Assignee:
NAT HOUSE IND
International Classes:
C09J5/00; E04C2/34; (IPC1-7): C09J5/00; E04C2/34
Domestic Patent References:
JP44031231A
Attorney, Agent or Firm:
Miyai Akio



 
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