Title:
BONDING OF RESIN MATERIAL
Document Type and Number:
Japanese Patent JPH01190432
Kind Code:
A
Abstract:
PURPOSE:To obtain a high bonding strength by applying a thermoplastic bonding agent solution to one of the bonding surfaces of a first component and a second component composed of thermoplastic resin, adhering and fixing a conductive material, powdery or granular, to its surface, overlapping the bonding surfaces of said two components and performing high frequency welding. CONSTITUTION:Thermoplastic bonding agent solution is applied in a given thickness on a bonding surface of one of a first and a second components. A powdery, granular, foil-like or fiber-like conductive material is sprayed uniformly on the surface of the bonding agent layer and adhered thereon before said layer is dried, and then the bonding agent layer is dried and the conductive material is adhered and fixed firmly to the surface of the bonding agent layer. The volume Xg/m<2> of the conductive material adhered and fixed should be set up in a manner to satisfy the formula X>=0.1Y to the applying volume Yg/m<2> of the thermoplastic bonding agent to the bonding surface. Next, the bonding surface of the other component is overlapped to the component on which the conductive material is adhered and fixed, and high frequency welding is carried out. The first and second components receive efficient induction heating action of the conductive material through the bonding agent layer and bonded quickly and firmly.
Inventors:
TAKEUCHI HIROKIMI
HIYAMIZU TAKAO
KATO YOSHIHISA
HIYAMIZU TAKAO
KATO YOSHIHISA
Application Number:
JP1567188A
Publication Date:
July 31, 1989
Filing Date:
January 26, 1988
Export Citation:
Assignee:
DAIDO STEEL CO LTD
International Classes:
B29C65/04; B29C65/36; B29C65/54; (IPC1-7): B29C65/04; B29C65/54
Attorney, Agent or Firm:
Michio Nakajima (2 outside)