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Patent Searching and Data


Title:
BONDING OF RUBBER TO METAL
Document Type and Number:
Japanese Patent JPH08100071
Kind Code:
A
Abstract:

PURPOSE: To provide a method for bonding directly a metal to a rubber by which the initial bonding power is high and the high bonding power is kept after thermal aging.

CONSTITUTION: A rubber material containing dipentamethylenethiuram tetrasulfide is placed on a metal item whose surface has been treated with a triazinethiol compound and they are bonded through vulcanization. To this rubber material, in addition to the dipentamethylenethiuram tetrasulfide, N-N'-m- phenylenedimaleimide, dibenzothiazyl disulfide, magnesium oxide, and lead monoxide may be added alone or in combination.


Inventors:
ITO SEIJI
ISHIKAWA KAZUHISA
MORI KUNIO
Application Number:
JP23558494A
Publication Date:
April 16, 1996
Filing Date:
September 29, 1994
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
C08J5/12; B32B15/06; C08K3/18; C08K3/22; C08K5/36; C08K5/40; C08K5/45; C08K5/47; C08L21/00; C09J121/00; (IPC1-7): C08J5/12; B32B15/06; C08K3/22; C08K5/40; C08K5/47; C08L21/00; C09J121/00
Attorney, Agent or Firm:
Suyama Saichi