Title:
BONDING SHEET, AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
Japanese Patent JP2023098498
Kind Code:
A
Abstract:
To properly bond members together.SOLUTION: A bonding sheet 10 includes a sintered body of copper in which first copper particles 12a with an average particle size of 1 μm or more and 16 μm or less and second copper particles 12b with an average particle size of 300 nm or less are at least partially sintered and bonded together, the bonding sheet having a specific surface area of 0.16 m2/g or more and 2.44 m2/g or less and a Young's modulus of 25 GPa or less.SELECTED DRAWING: Figure 1
Inventors:
MASUYAMA KOTARO
NAKAYA KIYOTAKA
NAKAYA KIYOTAKA
Application Number:
JP2021215298A
Publication Date:
July 10, 2023
Filing Date:
December 28, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B22F3/00; B22F1/00; B22F1/052; B22F1/054; B22F7/08
Attorney, Agent or Firm:
Sakai International Patent Office
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