Title:
BONDING TAPE FOR WATERPROOF SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014173329
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding tape for a waterproof substrate, capable of suppressing the deterioration of waterproof function and deaeration function, and improved in reliability.SOLUTION: A bonding tape 1 for a waterproof substrate comprises: a tape body 2 which is a laminate for bonding waterproof sheets; and a release sheet 3 covering the surface of the tape body 2 and releasable from the tape body 2. The tape body 2 includes a cloth 5 where a plurality of openings are formed, a resin layer 6 covering the cloth 5, and an adhesive layer 7 applied to the resin layer 6. The tape body 2 includes a seal part 8 formed at the center in the width direction W and side parts 9 formed respectively on both sides of the seal part 8, a resin is included in the cloth 5 in the entire width thereof, and the seal part 8 and the side parts 9 are integrated together. The cloth 5 and the resin layer 6 are integrated together in the entire width of the tape body 2, its dimensional change is reduced, damaging to a coated film waterproof material is suppressed, and deterioration in waterproofness as well as in deaeration is suppressed.
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Inventors:
TSURUMAKI FUMITOSHI
Application Number:
JP2013046945A
Publication Date:
September 22, 2014
Filing Date:
March 08, 2013
Export Citation:
Assignee:
NITTO BOSEKI CO LTD
International Classes:
E04D5/14; B32B27/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yoshinori Shimizu
Yoshiki Kuroki
Yoshinori Shimizu
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