Title:
BONDING TOOL
Document Type and Number:
Japanese Patent JP2809198
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding tool which can reduce laser irradiation time and increase bonding speed by effectively using the thermal energy of a laser light in order to rise the temperature of the tip part of a bonding tool, and reducing loss of the heat to the upper part of a bonding tool.
SOLUTION: When SiN is used as a tool tip part 26 at the bonding of inner lead, the whole part of a tool except the tool tip part 26 is constituted of low thermal conductivity material 27 made of zirconia which is far more excellent in thermal insulation than SiN. When the tool tip part 26 is irradiated with a laser light 13, losing of the heat to the upper part of the tool can be remarkably reduced by the effect of the low thermal conductivity material 27, as compared with the conventional tool wherein the whole part is formed of SiN. Thereby the temperature rise of the tool tip part 26 is accelerated, and bonding speed can be increased.
Inventors:
KOBAYASHI NOBUHIKO
Application Number:
JP13791196A
Publication Date:
October 08, 1998
Filing Date:
May 31, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B23K26/21; H01L21/60; (IPC1-7): H01L21/60; B23K26/00
Domestic Patent References:
| JP58197834A | ||||
| JP4352440A | ||||
| JP4247700A | ||||
| JP3220741A | ||||
| JP338846A | ||||
| JP8146451A | ||||
| JP5259220A |
Attorney, Agent or Firm:
Matsuura