PURPOSE: To eliminate damage to the active surface of a semiconductor device and the bonding surface of a bonding tool by a method wherein recessed parts are provided in the bonding surface, on which electrodes on the semiconductor device and a group of inner leads are connected to each other, of the semiconductor element.

CONSTITUTION: A square recessed part and the other recessed part of a depth of about 0.5 to 2mm are provided in parts, which are situated with in the bonding surface of a bonding tool and on which semiconductor device electrodes 4 are not formed at all, of a semiconductor device. As there are various arrangements of the electrodes 4 on the semiconductor device, the various recessed parts are provided resultantly according to the kinds of the semiconductor device 5. By providing the recessed parts, damage to the active surface of the device 5 and damage to the bonding surface 2 of the bonding tool due to semiconductor device fragments and other dusts are eliminated and at the same time, when heat is applied by the tool 1, the device 5 is not overheated.