Title:
BONDING WIRE AND FORMATION THEREOF
Document Type and Number:
Japanese Patent JP3436676
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance durability of bonding wires connecting electrode pads to prolong its life.
SOLUTION: A bonding wire 21 is connected between an electrode pad 2 of a substrate 1 and an electrode pad 5 of a bare chip element 3. One side lead part 23 of the bonding wire 21 is shaped into an letter S. The S-shape lead part 27 acts to disperse stresses at a point of the other side connector 26 of the wire 21 and to enhance durability of the wire 21.
Inventors:
Kenji Ohshima
Application Number:
JP3389098A
Publication Date:
August 11, 2003
Filing Date:
January 30, 1998
Export Citation:
Assignee:
Hitachi Unisia Automotive Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP59150461A | ||||
| JP63164330A | ||||
| JP211333U |
Attorney, Agent or Firm:
Kazuhiko Hirose
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