Title:
BONDING WIRE INSPECTION DEVICE
Document Type and Number:
Japanese Patent JP3184640
Kind Code:
B2
Abstract:
PURPOSE: To provide a bonding wire inspection device capable of making both an inspection by image processing and a visual observation on a bonding wire, and making the high-precision inspection.
CONSTITUTION: A bonding wire inspection device is provided with an image pickup device 5 for photographing the bonding state between a semiconductor chip 3 and a lead frame 2 to obtain an image, a processor 9 making an inspection based on the image obtained by the image pickup device 5, and a stereoscopic microscope 1 provided near the image pickup device 5 as an observing device. A specific semiconductor chip is photographed by the image pickup device 5, then it is conveyed to the observation area of the stereoscopic microscope 1 by a conveying mechanism 4.
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Inventors:
Nobuto Kawahara
Masaki Kobayashi
Tetsushi Ohnuma
Masato Nagura
Minokichi Ban
Masaki Kobayashi
Tetsushi Ohnuma
Masato Nagura
Minokichi Ban
Application Number:
JP32191192A
Publication Date:
July 09, 2001
Filing Date:
December 01, 1992
Export Citation:
Assignee:
Canon Inc
International Classes:
G01B11/24; H01L21/60; H01L21/66; (IPC1-7): G01B11/24; H01L21/60
Domestic Patent References:
| JP57134944A | ||||
| JP62261905A | ||||
| JP6336543A | ||||
| JP63144531A |
Attorney, Agent or Firm:
Keizo Nishiyama (1 person outside)
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