Title:
BONDING WIRE AND ITS PRODUCING METHOD
Document Type and Number:
Japanese Patent JP3494175
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding wire strong against wire flow and exhibiting excellent tensile strength in which occurrence of leaning can be suppressed at the time of wire bonding even in the case of a narrow bonding pitch.
SOLUTION: When a wire casting material is drawn into a wire and subjected to final annealing, middle annealing is performed at least once in the way of wire drawing and the area machining rate of the wire is set in the range of 75-99.997% for each annealing leading to the final annealing through the middle annealing. A resulting bonding wire is heated in a temperature atmosphere of 523K for 15-25 sec and tensile strength (high temperature strength) measured subsequently in the temperature atmosphere of 523K (250°C) is higher than 0.2% durability measured in a temperature atmosphere of 298K (25°C)t. The bonding wire can thereby be evaluated and managed easily by measuring the high temperature strength.
Inventors:
Hideyuki Yamashita
Ryo Togashi
Eiji Murase
Ryo Togashi
Eiji Murase
Application Number:
JP2002004346A
Publication Date:
February 03, 2004
Filing Date:
January 11, 2002
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
H01L21/60; C22C5/02; C22F1/14; (IPC1-7): H01L21/60; C22F1/14
Domestic Patent References:
| JP436430A | ||||
| JP607163A | ||||
| JP63241942A |
Attorney, Agent or Firm:
Masao Yamamoto