Title:
半導体装置用ボンディングワイヤ
Document Type and Number:
Japanese Patent JP4719299
Kind Code:
B2
Abstract:
It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains at least one of palladium and gold, and copper . The outer layer is 0.021 to 0.12µm in thickness.
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Inventors:
Tomohiro Uno
Keiichi Kimura
Shinichi Terashima
Takashi Yamada
Nishibayashi Kagehito
Keiichi Kimura
Shinichi Terashima
Takashi Yamada
Nishibayashi Kagehito
Application Number:
JP2010073297A
Publication Date:
July 06, 2011
Filing Date:
March 26, 2010
Export Citation:
Assignee:
Nippon Steel Materials Co., Ltd.
Nittetsu Micro Metal Co., Ltd.
Nittetsu Micro Metal Co., Ltd.
International Classes:
H01L21/60; C22C5/02; C22C5/04; C22C9/00; C22C9/02; C22C9/06; C22C27/04; C22C27/06; C22F1/08; C22C19/03; C22F1/00
Domestic Patent References:
| JP2006216929A | ||||
| JP2004064033A |
Attorney, Agent or Firm:
Mamoru Ushiki
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki