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Title:
ボラジン系樹脂組成物及びその製造方法、絶縁被膜及びその形成方法、並びに電子部品
Document Type and Number:
Japanese Patent JP5540416
Kind Code:
B2
Abstract:

To provide an insulation coating which contains little metallic impurities and can sufficiently suppress occurrence of leak current, to provide a method for producing the insulation coating, to provide a borazine-based resin composition efficiently formable of the insulation coating, and to provide a method for producing the borazine-based resin composition.

The borazine-based resin composition includes a polymer having a borazine skeleton on a main chain or a side chain and a solvent dissolvable of the polymer, wherein the polymer is an organosilicon borazine-based polymer, the solid concentration is 0.5 mass% or more and the content of the metallic impurities is 30 ppm or less.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
Hiroshi Matsutani
Yuko Uchimaru
Application Number:
JP2011020137A
Publication Date:
July 02, 2014
Filing Date:
February 01, 2011
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
National Institute of Advanced Industrial Science and Technology
International Classes:
C08L83/14; C08G77/56; C08K5/00; C09D5/25; C09D183/14; C09D185/04
Domestic Patent References:
JP2002155143A
JP2002155144A
JP2000256466A
JP2255689A
JP2004137475A
Foreign References:
WO2001066624A1
Other References:
内丸祐子, 他,低誘電率ケイ素-ボラジンポリマーの合成、薄膜化と特性評価,高分子学会予稿集,日本,2002年 9月18日,Vol.51 No.12,p.3077-3078
井上正巳,他,ボラジン-シロキサン系有機・無機ハイブリッドポリマーの応用,2002年秋季第63回応用物理学会学術講演会講演予稿集,日本,(社)応用物理学会,2002年 9月24日,第2分冊,p.765,26p-M-12
独立行政法人 産業技術総合研究所,層間絶縁膜用低誘電率材料(ボラジン-ケイ素ポリマー)を開発,プレスリリース(インターネットウェブサイト),日本,独立行政法人 産業技術総合研究所,2002年 3月25日
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita



 
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