Title:
BORING DEVICE OF MATERIAL DIFFICULT TO WORK
Document Type and Number:
Japanese Patent JP2001347408
Kind Code:
A
Abstract:
To shorten boring time when boring a material difficult to work such as metal difficult to work and ceramics including tungsten, to restrain wearing of a cutting tool, and to eliminate a crack of the material.
This boring device is provided with the cutting tool 12 for cutting the material 11 difficult to work of a work object vertically upward from the under surface and a rotary means 13 for rotating at least either one of the material or the cutting tool.
Inventors:
Kitazawa, Hideaki
Kido, Yoshio
Kido, Yoshio
Application Number:
JP2000000171229
Publication Date:
December 18, 2001
Filing Date:
June 07, 2000
Export Citation:
Assignee:
NATIONAL INSTITUTE FOR MATERIALS SCIENCE
KITAZAWA HIDEAKI
KIDO YOSHIO
KITAZAWA HIDEAKI
KIDO YOSHIO
International Classes:
B23Q17/09; B23B47/24; B23B49/00; B23Q17/09; B23B47/00; B23B49/00; (IPC1-7): B23B47/24; B23B49/00; B23Q17/09
Previous Patent: BORING MACHINE FOR PIPING AND BORING METHOD FOR PIPING
Next Patent: ROTATIONAL VIBRATION DEVICE
Next Patent: ROTATIONAL VIBRATION DEVICE