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Title:
BOTH-HEAD PLANAR GRINDING DEVICE AND PLANAR GRINDING METHOD FOR PLATE WORK
Document Type and Number:
Japanese Patent JP2002178245
Kind Code:
A
Abstract:

To improve grinding accuracy and efficiency of a plate work by preventing the clogging of a grinding wheel portion and improving the cutting quality.

When the both surfaces of a disk-shaped work W are simultaneously ground by a lower rotary grinding wheel 15 and an upper rotary grinding wheel 16 while rotating the disk-shaped work W, liquid vibrated by a vibration device 60 using ultrasonic vibrator is injected to the both surfaces of the disk- shaped work W to apply the ultrasonic vibration to the disk-shaped work W. The disk-shaped work W contacts with the grinding wheel portions 15A and 16A of the lower rotary grinding wheel 15 and the upper rotary grinding wheel 16, while ultrasonic-vibrating and the ultrasonic vibration eliminates the chips of the grinding wheel portions 15A and 16A to prevent the clogging. In the lower rotary grinding wheel 15 and the upper rotary grinding wheel 16, the cutting quality of the grinding wheel portions 15A and 16A is improved to lower the grinding resistance and enable the fine cut into the disk-shaped work W. Thereby, the grinding accuracy and efficiency of the disk-shaped work W can be improved.


Inventors:
MURAI SHIRO
OKUYAMA TETSUO
KAWAZU TOMOYUKI
Application Number:
JP2000379841A
Publication Date:
June 25, 2002
Filing Date:
December 14, 2000
Export Citation:
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Assignee:
NIPPEI TOYAMA CORP
International Classes:
B24B7/17; B24B37/08; B24B41/06; B24B55/02; B24B55/06; H01L21/304; (IPC1-7): B24B7/17; B24B41/06; B24B55/02; B24B55/06; H01L21/304
Attorney, Agent or Firm:
Dozo Isono