Title:
SEMICONDUCTOR HEATING APPARATUS
Document Type and Number:
Japanese Patent JP3224628
Kind Code:
B2
Abstract:
PURPOSE: To process semiconductor of large area at the same time and decrease imperfect adhesion, deterioration, disconnection and crack generation of a resistance heating element buried in dense ceramic, in a ceramic heater for semiconductor heating.
CONSTITUTION: On a board-like member 1 composed of dense ceramic, a semiconductor heating surface 1c is formed. Recess parts 1a are formed on the surface except the semiconductor heating surface. Each of the ceramic heaters 2 has a base body 4 composed of dense ceramic and a resistance heating element 6 buried in the base body 4. At least a part of each of the base bodies 4 of a plurality of the ceramic heaters 2 is accommodated in the recess part 1a, and the surface of each base body 4 is in contact with the board-like member 1.
Inventors:
Shinji Yamaguchi
Junji Sakon
Junji Sakon
Application Number:
JP5430393A
Publication Date:
November 05, 2001
Filing Date:
March 15, 1993
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L21/205; H01L21/302; H01L21/3065; (IPC1-7): H01L21/205; H01L21/3065
Domestic Patent References:
| JP487179A |
Attorney, Agent or Firm:
Akihide Sugimura (9 outside)