Title:
MATERIAL FORMED PATINA AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH0718485
Kind Code:
A
Abstract:
PURPOSE: To produce a material with patina formed in a tightly adhered state.
CONSTITUTION: A Cu layer is electrodeposited on a substrate at current density exceeding limiting current density to increase the surface roughness and a Cu layer is electrodeposited on the above Cu layer in one body at current density below limiting current density to prevent the separation of powder from the Cu layer. Since an electrodeposited layer having high roughness and not causing the separation of powder is formed on the surface of the substrate, the adhesion of patina is improved and the resulting material can maintain its fine appearance over a long period of time when used as a shingle, etc.
Inventors:
SUDA HIDEO
TANI TOSHIO
IGARASHI MINORU
TANI TOSHIO
IGARASHI MINORU
Application Number:
JP18917193A
Publication Date:
January 20, 1995
Filing Date:
July 01, 1993
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C23C22/00; C23C28/02; C25D3/38; C25D5/10; C25D5/48; C25D11/34; (IPC1-7): C25D5/10; C23C22/00; C23C28/02; C25D3/38; C25D5/48; C25D11/34
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