To provide a brazing filler metal capable of firmly joining a ceramic member with a metal member, a heat radiation base body which is joined by using the brazing filler metal while allowing any short-circuit to hardly occur even when repeating the heat radiation, and an electronic apparatus in which electronic components are mounted on a circuit member of the heat radiation base body.
The brazing filler metal mainly consists of copper and tin, and contains at least one kind of active metal to be selected among titanium, zirconium, hafnium, and niobium, and silver wherein the content of silver is ≥5 mass% and ≤18 mass%. The brazing filler metal is capable of suppressing embrittlement caused by the coupling of the active metal with copper, and preventing degradation of the joining strength of a supporting substrate 21 with a circuit member 41 and a heat radiation member 42 associated with the embrittlement. The brazing filler metal has the viscosity so that any unnecessary projection thereof is less at a joined part between the supporting substrate 21, the circuit member 41 and the heat radiation member 42.
NAKAMURA KIYOTAKA
TANIGUCHI YOHEI
| JP2003283064A | 2003-10-03 | |||
| JPH0969672A | 1997-03-11 | |||
| JPS62289396A | 1987-12-16 |
| WO2007105361A1 | 2007-09-20 |
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