Title:
脆性材料基板のブレイク装置
Document Type and Number:
Japanese Patent JP6078107
Kind Code:
B2
Inventors:
Makoto Takeda
Kenji Murakami
Kenta Tamura
Kenji Murakami
Kenta Tamura
Application Number:
JP2015120819A
Publication Date:
February 08, 2017
Filing Date:
June 16, 2015
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B26F3/00; B28D7/04
Domestic Patent References:
| JP60122113A | ||||
| JP2004050305A | ||||
| JP2000167825A | ||||
| JP2002189000A | ||||
| JP2004327773A | ||||
| JP61051310A |