Title:
脆性材料基板ブレイク装置
Document Type and Number:
Japanese Patent JP5548172
Kind Code:
B2
Inventors:
Mitsuru Sugata
Kenji Murakami
Masakazu Takeda
Kenji Murakami
Masakazu Takeda
Application Number:
JP2011184297A
Publication Date:
July 16, 2014
Filing Date:
August 26, 2011
Export Citation:
Assignee:
Samsung diamond industrial incorporated company
International Classes:
B28D5/00; C03B33/023; H01L21/301