Title:
広帯域高周波スリップリングシステム
Document Type and Number:
Japanese Patent JP4874380
Kind Code:
B2
Abstract:
A slip ring platter for a contacting ring system comprising:
a printed circuit board (PCB) with a first and a second side
a first plurality of concentric spaced conductive rings located on the first side of the PCB,
a first and a second feedline routed internally within the PCB,
a ground plane located on the second side of the first PCB, wherein the first feedline is coupled to a first of the concentric spaced conductive rings through a first conductive via and the second feedline is coupled to a second of the concentric spaced conductive rings through a second conductive via.
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Inventors:
Coleman, Donnie, Es.
Application Number:
JP2009246598A
Publication Date:
February 15, 2012
Filing Date:
October 27, 2009
Export Citation:
Assignee:
Moog Incorporated
International Classes:
H01P1/06; H01R13/6474; H01R13/6477; H01R13/658; H01R39/00; H01R39/18; H01R39/24; H01R35/02; H01R39/08; H01R39/64
Domestic Patent References:
| JP7303629A | ||||
| JP6326506A | ||||
| JP11162608A | ||||
| JP61082696A | ||||
| JP2000228265A | ||||
| JP2001102747A | ||||
| JP2000243527A | ||||
| JP63131086U | ||||
| JP3053052U | ||||
| JP3077505U | ||||
| JP6163652A |
Attorney, Agent or Firm:
Yu Saito
Fumihiko Ito
Fumihiko Ito