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Title:
BRUSH FOR WASHING OF POLISHING PAD OF CHEMICAL MECHANICAL POLISHING EQUIPMENT
Document Type and Number:
Japanese Patent JP2004306234
Kind Code:
A
Abstract:

To provide a polishing brush for a polishing pad of chemical mechanical polishing equipment not using an adhesive agent.

A brush 30 for washing a polishing pad of a chemical mechanical polishing equipment, while feeding a liquid, comprises a brush main body 36 having bristle transplant holes 38 and brush bristle bundles 34 fixed to the bristle transplant holes 38, wherein the brush bristle bundles 34 are pressed into and fixed to the bristle transplant holes 38 in a twofold state by using an embedding member 40, and the brush bristles 32 are made of a material swollen with liquid. Thus, when the polishing pad is washed, the brush bristles 32 are swollen with liquid and a prescribed tensile strength is ensured. Since an adhesive agent is not used, dust is prevented from newly occurring, and an effective length of the brush bristle functioning as a brush bristle can be secured relatively long.


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Inventors:
SAITO MASASHI
OE TOSHIAKI
Application Number:
JP2003106730A
Publication Date:
November 04, 2004
Filing Date:
April 10, 2003
Export Citation:
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Assignee:
APPLIED MATERIALS INC
International Classes:
A46B3/16; A46D1/00; B24B53/12; (IPC1-7): B24B53/12; A46B3/16; A46D1/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yasuhito Suzuki