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Title:
BUBBLE AND FOAM SOLUTION METHOD USING COMPLETELY IMMERSED AIR-FREE FEEDBACK FLOW CONTROL VALVE
Document Type and Number:
Japanese Patent JP2014132115
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for electroplating material onto a substrate, which greatly reduces incorporation of gas into a processing fluid when the processing fluid returns from a processing cell to a reservoir.SOLUTION: The apparatus comprises: an electroplating cell comprising a vessel for holding electrolyte, a weir wall positioned at the periphery of the vessel, and a fluid collection trough substantially surrounding the weir wall, such that during electroplating, electrolyte flows into the vessel, over the weir wall and into the fluid collection trough; an electrolyte reservoir; a return conduit for delivering electrolyte from the fluid collection trough to the electrolyte reservoir; and a flow control mechanism for variably increasing and decreasing a resistance to flow in the return conduit, where the flow control mechanism substantially prevents the passage of gas through the return conduit during electroplating.

Inventors:
RICHARD ABRAHAM
ROBERT RASH
DAVID PORTER
STEVEN T MAYER
JOHN OSTROWSKI
Application Number:
JP2013255654A
Publication Date:
July 17, 2014
Filing Date:
December 11, 2013
Export Citation:
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Assignee:
LAM RES CORP
International Classes:
C25D7/12; G05D7/00; H01L21/288; H01L21/3205; H01L21/768
Domestic Patent References:
JPH0456799A1992-02-24
JPH02122098A1990-05-09
JPH02122098A1990-05-09
JPH0456799A1992-02-24
Foreign References:
WO2001068952A12001-09-20
WO2001068952A12001-09-20
Attorney, Agent or Firm:
Meisei International Patent Office
Yoshinobu Inoue