Title:
BUFFER MATERIAL
Document Type and Number:
Japanese Patent JP2005280835
Kind Code:
A
Abstract:
To eliminate adverse effect on natural environment when disposed of.
The buffer material 5 is used when an article is packaged into a container such as a cardboard box. One or a plurality of materials selected from grains including rice and corns, seeds and nuts including acorns, chestnuts, cotton, coconuts or the like, and vegetation fibers including wood, bamboo sheath, stems, and roots are foamed by heat and pressure to form foams 1, 2. Gas contained in bubbles 3 of the foams 1, 2 is an inert gas containing a nitrogen or argon gas of 81-100%. The foams 1, 2 are filled into a bag 4 formed of a biodegradable resin or a photolytic resin.
Inventors:
MATSUBARA YOSHIMASA
Application Number:
JP2004130510A
Publication Date:
October 13, 2005
Filing Date:
March 29, 2004
Export Citation:
Assignee:
TAISEI KAKEN KK
International Classes:
B65D81/09; B65D81/07; B65D81/113; (IPC1-7): B65D81/09; B65D81/07; B65D81/113
Attorney, Agent or Firm:
Shukichi Nakagawa
Hiroyuki Nakagawa
Kosuke Tobita
Sorimachi Yukiyoshi
Hiroyuki Nakagawa
Kosuke Tobita
Sorimachi Yukiyoshi
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