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Patent Searching and Data


Title:
Buffer structure And shoes to which this is applied
Document Type and Number:
Japanese Patent JP5985070
Kind Code:
B2
Abstract:
The present invention addresses a problem to develop a novel shock absorbing structure which enables a repulsive force to shift to a kick-out motion of a wearer smoothly while enabling impact to be absorbed stepwise when incorporated into a sole of a shoe or the like, for example, and a shoe to which the shock absorbing structure is applied. [Solution] A shock absorbing structure of the present invention is formed by including a column member, an elastic ring member that is provided by being fitted onto the column member, and upper and lower pressure receiving portions that are connected by the column member, wherein the column member is capable of being deformed and restored at least in a pressure receiving direction, the ring member has an effective working height set to be lower than the column member, and is formed to be in a non-bonded state with the upper and lower pressure receiving portions, and at a time of pressure reception, the column member undergoes compression deformation in the pressure receiving direction first, and thereafter, the ring member undergoes compression deformation in the pressure receiving direction next, whereby multi-stage shock absorbing performance is exhibited.

Inventors:
Kurosaki Kiyomitsu
Three Kingdoms
Hiroshi Nasuno
Application Number:
JP2015543581A
Publication Date:
September 06, 2016
Filing Date:
October 21, 2013
Export Citation:
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Assignee:
ASICS Corporation
Taika Co., Ltd.
International Classes:
A43B13/18
Domestic Patent References:
JPH0686514U1994-12-20
JPH10327906A1998-12-15
Attorney, Agent or Firm:
Takahiko Higashiyama