To provide a resin composition for build-up use free from generation of hydrogen bromide, etc., and having excellent heat-resistance and moisture resistance by adding a phosphoric acid ester and a hydrated metal compound together with melamines and/or benzoguanamines as a flame-retardant in a build-up resin composition without using a halogen-containing compound.
The objective resin composition for build-up use applicable for the build-up of a multilayer printed circuit board contains (A) a thermoplastic resin or thermosetting resin having a weight-average molecular weight of ≥10,000, (B) an epoxy resin, (C) melamines and/or benzoguanamines, (D) a condensed phosphoric acid ester, (E) a hydrated metal compound, (F) a curing agent and (G) a cure accelerator as essential components. The ratio of the thermoplastic resin or thermosetting resin A is 5-70 wt.% based on the total weight of the components A to G, that of the condensed phosphoric acid ester D is 5-30 wt.% and the ratio of the hydrated metal compound E is 10-100 wt.%.
HANAMURA KENICHIRO
INMAKI NORIKO
