Title:
BUILD-UP TYPE MULTILAYER PRINTED CIRCUIT BOARD, RESIN COMPOSITION THEREFOR, AND RESIN FILM
Document Type and Number:
Japanese Patent JP3403987
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a build-up type multilayer printed circuit board that can be burned to release no toxic gas such as hydrogen bromide and is excellent in heat resistance, moisture resistance and corrosion resistance; a resin composition for build-up to use for preparing the board; and a carrier-supported resin film.
SOLUTION: The resin composition for build-up comprises (A) a thermoplastic resin or a thermosetting resin having a weight-average molecular weight of 10,000 or above, (B) a phosphorus-containing epoxy resin having a reactive component of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a derivative thereof, (C) an inorganic filler, (D) a curing agent, and (E) a curing promoter as the essential components, wherein the thermoplastic resin or the thermosetting resin of (A) is contained in a rate of 5-70 wt.% relative to the total weight of (A)-(E). The resin composition is applied for the build-up of a multilayer printed circuit board.
Inventors:
Tomohiro Iwasaki
Tetsuaki Suzuki
Tetsuaki Suzuki
Application Number:
JP36874499A
Publication Date:
May 06, 2003
Filing Date:
December 27, 1999
Export Citation:
Assignee:
Kyocera Chemical Corporation
International Classes:
H05K3/46; C08G59/20; C08K3/00; C08L63/00; C08L101/00; (IPC1-7): C08G59/20; C08K3/00; C08L63/00; C08L101/00; H05K3/46
Domestic Patent References:
| JP2001151990A | ||||
| JP2000239525A | ||||
| JP11279258A | ||||
| JP11340610A | ||||
| JP11343398A |
Attorney, Agent or Firm:
Eiji Morota
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