To prevent the data communication rate from lowering or the size of a substrate structure from increasing even if a build-up wiring substrate structure is employed and wiring is made from an element mounted on an upper layer wiring substrate to a connector.
One or more than one lower layer side connector 6 connected with a lower layer side circuit 4 and provided with a ground connection part 10 on the front side is secured to a lower layer wiring substrate 2, and one or more than one upper layer side connector 7 connected with an upper layer side circuit 5 and provided with a ground connection part 10 on the front side is secured to an upper layer wiring substrate 3 at a position adjacent to the lower layer side connector 6. A conductive securing metal 11 is secured to the front side of the lower layer side connector 6 and the upper layer side connector 7 such that it is connected with the ground connection part 10. As compared with a case where the upper layer side circuit 5 mounted on the upper layer wiring substrate 3 is wired to a connector secured to the layer wiring substrate 2, the wiring pattern length is shortened and the substrate structure is simplified.
NAGAYUMI KUNIMASA
TSUCHIYA HIROTERU
KATABIRA YASUHIRO
UESONO TAKANORI
KATSUUMI AKIHIRO
MATSUMOTO KOBO
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