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Patent Searching and Data


Title:
BUILDING BOARD MATERIAL
Document Type and Number:
Japanese Patent JPH07314406
Kind Code:
A
Abstract:

PURPOSE: To provide a building board material which makes good use of good qualities of both a needle-leaved tree and MDF (a medium density fiber board), covers badness and is hard to go bad, strong in not only cracking but also breaking of the surface, easy in formation of contents and superior in shock resistance.

CONSTITUTION: A building board material is comprised by laminating a board material 2 comprised of an MDF on the top of a board material 1 comprised of a needle-leaved tree, on which a board material 5 of lauan material is laminated further, a building board material is comprised by forming a substance in the board material 5 and furthermore, in addition to the original constitution, a building board material is comprised by laminating a cushioning material layer 6 between the board materials 1, 2.


Inventors:
IMAI AKIRA
Application Number:
JP11551794A
Publication Date:
December 05, 1995
Filing Date:
May 27, 1994
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B27D5/00; B27D1/04; B27M3/04; B32B21/02; (IPC1-7): B27D5/00; B27D1/04; B27M3/04; B32B21/02
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)