Title:
BUILDING BOARD
Document Type and Number:
Japanese Patent JP2017013360
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a building board in which a gap is hardly generated between adjacent building boards, and a building board fixed to a structural material is hardly exfoliated, even when the inorganic building board having a core layer and a skin layer is exposed to a high temperature.SOLUTION: In a building board 1 including a core layer 2 formed of a molding material containing a hydraulic inorganic material, and a skin layer 3 formed of the molding material containing the hydraulic inorganic material, and covering the core layer 2, an absolute dry specific gravity of the skin layer 3 is higher than an absolute dry specific gravity of the core layer 2, and a strength heat shrinkage of the skin layer 3 is 10% or lower, and a strength heat shrinkage of the core layer 2 is 13% or lower.SELECTED DRAWING: Figure 1
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Inventors:
YAMAMOTO TOMOHISA
FURUMIYA TAKASHI
SHIROMOTO HIROYUKI
OKAJIMA YUSAKU
KITAMURA TAKURO
FURUMIYA TAKASHI
SHIROMOTO HIROYUKI
OKAJIMA YUSAKU
KITAMURA TAKURO
Application Number:
JP2015132329A
Publication Date:
January 19, 2017
Filing Date:
July 01, 2015
Export Citation:
Assignee:
KMEW CO LTD
International Classes:
B28B3/20; B32B7/02; B32B13/00; C04B28/02
Domestic Patent References:
| JPH10273356A | 1998-10-13 | |||
| JP2013203600A | 2013-10-07 | |||
| JP2004511685A | 2004-04-15 | |||
| JP2006063573A | 2006-03-09 |
Attorney, Agent or Firm:
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura