Title:
バルク弾性波コンポーネントと無線通信デバイス
Document Type and Number:
Japanese Patent JP7284683
Kind Code:
B2
Abstract:
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components
Inventors:
Atsushi Takano
Takeshi Furusawa
Mitsuhiro Furukawa
Takeshi Furusawa
Mitsuhiro Furukawa
Application Number:
JP2019189453A
Publication Date:
May 31, 2023
Filing Date:
October 16, 2019
Export Citation:
Assignee:
SKYWORKS SOLUTIONS,INC.
International Classes:
H03H3/02; H01L21/301; H01L23/02; H01L23/06; H03H3/08; H03H9/17; H03H9/25
Domestic Patent References:
| JP2007202130A | ||||
| JP2007281526A | ||||
| JP2018101813A | ||||
| JP2016171263A | ||||
| JP2000028595A |
Foreign References:
| WO2006001125A1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Hiroko Hara
Masakazu Ito
Hiroko Hara