BULK MOLDING COMPOUND FOR DECORATIVE MOLDING AND DECORATIVE MOLDING PRODUCT USING THE SAME

Title:

BULK MOLDING COMPOUND FOR DECORATIVE MOLDING AND DECORATIVE MOLDING PRODUCT USING THE SAME

Document Type and Number:

Japanese Patent JP2000281848

Kind Code:

A

Abstract:

To obtain both a particle molding compound for decorative molding, capable of providing an excellent feeling of deepness from a transparent feeling of a base and applying a gorgeous marble grain-like decoration without losing surface smoothness, useful for decorative molding having slight fluidity and an inexpensive gorgeous marble grain-like decorative molding product prepared by using the compound into a double layer laminate.

This bulk molding compound for decorative molding comprises a resin component composed of (A) a styrene-maleic anhydride copolymer containing ≥2 wt.% maleic anhydride component, (B) an unsaturated polyester resin and (C) a monomer, a thickener and a pattern material component.

Inventors:

KITAGAWA YOSHINORI
TAKEZAKI HIDEAKI
KAWASAKI SHOHEI

Application Number:

JP28304999A

Publication Date:

October 10, 2000

Filing Date:

October 04, 1999

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD

International Classes:

B29C43/20; C08F2/44; C08F283/01; C08K3/22; C08K7/00; C08L25/04; C08L35/00; C08L67/06; (IPC1-7): C08L25/04; B29C43/20; C08F2/44; C08F283/01; C08K3/22; C08K7/00; C08L35/00; C08L67/06

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