Title:
BUMP ELECTRODE
Document Type and Number:
Japanese Patent JPS60136339
Kind Code:
A
Abstract:
PURPOSE:To enable to prevent the corrosion generating on a conductive layer due to infiltration of a corrosive substance which developes into disconnection of wires by a method wherein a base material, having an eave closely contacted to the upper face of the insulating film located on the circumference of the aperture part of a through hole, is provided using a metal having an excellent corrosion-resisting property. CONSTITUTION:A bump electrode 1 is composed of conductive layer 7, consisting of the two layer of a titanium layer 5 and a copper layer 6 formed between an insulating film 2 consisting of polyimide and the final passivation film 4 such as plasma nitride film and the like which is formed in deposition on the upper surface of a pellet 3 consisting of a polyimide insulating film 2, and an almost semispherical solder which is electrically connected through the intermediary of a base metal 8 consisting of nickel. The base metal 8 comes in contact with the copper layer 6 using a through hole 9 formed at a part of the insulating film 2, and said base metal 8 is provided in such a manner that an eave 10, which is closely contacted to the upper surface of the insulating film located on the circumference of the aperture part of the through hole, can be formed.
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Inventors:
KAWANOBE TOORU
MIYAMOTO KEIJI
ICHIHARA SEIICHI
MIYAMOTO KEIJI
ICHIHARA SEIICHI
Application Number:
JP24405283A
Publication Date:
July 19, 1985
Filing Date:
December 26, 1983
Export Citation:
Assignee:
HITACHI LTD
HITACHI MICROCUMPUTER ENG
HITACHI MICROCUMPUTER ENG
International Classes:
H01L21/60; (IPC1-7): H01L21/92
Attorney, Agent or Firm:
Akio Takahashi
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