Title:
BUMP FLATTENING DEVICE, BUMP FLATTENING METHOD, AND BUMP BONDING UNIT
Document Type and Number:
Japanese Patent JP3961442
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable a large number of gold bumps formed on a substrate, such as a wafer or the like, to be shaped well and made uniform in height.
SOLUTION: The wafer 40 where the bumps are provided on its top surface is placed on a mounting stand 16, the heads of the gold bumps on the wafer 40 are pressed down with the lower end of a rotating roller 18, and the mounting stand 16 is horizontally and relatively moved to the rotating roller 18. At this point, the mounting stand 16 is moved at such a speed that the relative speed of the mounting stand 16 to the lower part of the rotating roller 18 becomes nearly zero.
Inventors:
Susumu Sumiya
Application Number:
JP2003099511A
Publication Date:
August 22, 2007
Filing Date:
April 02, 2003
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP4317335A | ||||
| JP1091440A | ||||
| JP2000150559A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida