Title:
BUMP FORMING METHOD, SEMICONDUCTOR DEVICE, AND BUMP FORMING DEVICE
Document Type and Number:
Japanese Patent JP2002076043
Kind Code:
A
Abstract:
To provide a bump forming method, a semiconductor device, and a bump forming device, for forming a solder bump at a terminal electrode with no cleaning.
There are provided a solder particle discharge process where a molten solder particle 3 is discharged toward an electrode 1 provided at a solder chip 2, and an irradiation process where, after the solder particle is discharged, the solder particle 3 and the electrode 1 are irradiated with laser beam 6.
Inventors:
NOGUCHI TOSHIE
Application Number:
JP2000257354A
Publication Date:
March 15, 2002
Filing Date:
August 28, 2000
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K1/00; B23K1/005; B23K3/06; H01L21/60; H05K3/34; B23K101/40; (IPC1-7): H01L21/60; B23K1/00; B23K1/005; B23K3/06; H05K3/34
Attorney, Agent or Firm:
Hisami Fukami (4 outside)
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