To efficiently true up the height of bumps which constitute a wafer and are formed in a device.

In the bump processing equipment having such a configuration that an imaging means 12 and a cutting means 3 operate in conjunction with each other; the imaging means 12 focuses on the top of a bump B, and with the position of the cutting means 3 at that time as the origin, the cutting means 3 is driven with the origin as the basis to cut the bump B. Since the origin is set up on the wafer-by-wafer basis, the bump can be accurately and efficiently cut by a desired quantity even if there is the variation in thickness among wafers.